Micon Global Announces Strategic Partnership with Chestnut Biopolymers to Deliver Sustainable ESD and Dissipative Packaging Solutions for the Semiconductor Industry
Micon Global is pleased to announce a strategic sales partnership with Chestnut Biopolymers, a UK-based pioneer in advanced, majority plant-based materials engineered to match the performance characteristics of conventional plastics — while delivering a significantly reduced environmental footprint.
This collaboration brings together Micon Global’s established market expertise and distribution network with Chestnut’s next-generation biopolymer technology, creating a clear and accessible pathway for semiconductor manufacturers to transition away from fossil-based plastics in their supply chains.
For the semiconductor industry, this partnership addresses a critical and long-overdue challenge. JEDEC-compliant shipping trays, carriers, and handling materials have historically relied on oil-based plastics, generating thousands of tonnes of harmful plastic waste annually at end of life. Through this partnership, semiconductor manufacturers now have direct access to high-performance, biodegradable ESD and dissipative material alternatives that meet the rigorous technical demands of the industry — without compromising on functionality or compatibility.
Crucially, these biopolymer materials are designed for seamless integration into existing manufacturing workflows. In most cases, they are compatible with current tooling, meaning tray and carrier manufacturers can adopt sustainable alternatives with minimal operational disruption or capital investment.
This solution empowers semiconductor companies to make a measurable, confident step forward in reducing their environmental impact — ensuring that the materials used to ship their products are no longer a source of lasting harm to the planet.
About Chestnut Biopolymers
Chestnut Biopolymers develops engineered biopolymers that are performance-matched to demanding applications, targeting the functional requirements of PP, PE, and PS while offering a fundamentally different environmental outcome. Their materials are designed as true drop-in solutions that run on existing tooling and machinery, supporting processes such as injection moulding, blow moulding, sheet extrusion, thermoforming, corrugated sheet extrusion, printing, and finishing without the need to redesign products or retool factories. Built on renewable, plant-based feedstocks and enabling flexible end-of-life pathways including reuse, recovery, and biodegradation in natural environments, Chestnut’s portfolio allows customers to improve sustainability without compromising on performance or scalability.
In collaboration with RS Components, Chestnut Biopolymers has developed both conductive and dissipative versions of its biopolymer matrix, which RS has already deployed at scale within its automated IC carrier packaging lines. This innovation enables the wider electronics sector to move away from ESD trays and packaging made from fossil-based plastics toward a unique, majority plant-based biopolymer alternative that meets stringent ESD performance requirements. Coupled with an established global partnership to support collection, quality assurance, reuse, and recycling of ESD products, Chestnut’s solution paves the way for a smooth transition across the industry to a circular, plant-based electrical packaging platform.
About Micon Global
Since 2001, Micon Global has represented leading semiconductor, electronics, and technology providers, acting as a vital local point of contact for customers across EMEA and APAC. With a presence in key markets and a track record of driving adoption of advanced technologies, Micon will support Chestnut Biopolymers in expanding its global footprint, guiding customers from trials to commercial production and helping them build more circular, future-ready product lines.
Building on this role, Micon Global is leading the introduction of Chestnut’s conductive and dissipative biopolymer materials into the electronics sector, leveraging the proven success with RS Components to accelerate broader market uptake in applications such as ESD trays, IC carriers, and other protective packaging. By guiding customers from trials to commercial production, Micon and Chestnut aim to help the electronics industry shift towards.
More circular and plant-based packaging solutions while maintaining the reliability and performance that sensitive electronic components demand.