Amkor Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and SiP Applications
Amkor Technology, Inc. (Nasdaq: AMKR) today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT™). SWIFT is designed to handle the demanding requirements of today’s advanced mobile, networking and system-in-package (SiP) applications.
With its fine-feature photolithography and thin film dielectrics, SWIFT bridges the gap between through silicon via (TSV) and traditional wafer level fan-out (WLFO) packages. Compared to laminate-based substrate technologies, SWIFT offers dramatic improvements in form factor, signal integrity, power distribution and thermal performance. SWIFT incorporates an “RDL first” process that allows SWIFT wafers to be built and yielded ahead of the assembly process – accelerating production cycles and optimizing overall assembly yield.
“The semiconductor industry requires much higher levels of integration in a significantly reduced form factor,” said Ron Huemoeller, Amkor’s corporate vice president, Research & Development. “Completing the product qualification stage of SWIFT is an important milestone. We achieved success by leveraging our significant fan-out development experience and using our existing cutting-edge equipment. Our package and board-level reliability results demonstrate that SWIFT is ready for sampling by customers.”
SWIFT was named the “Device of the Year” at the 3D InCites Awards ceremony earlier this year. It was recognized for being “uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry.” SWIFT was also noted for its ability to deliver 2µm line/space lithography (with up to four layers of RDL) and a very dense network of memory interface vias at a very competitive price.
SWIFT is targeted for production in the second half of 2017 at K5, Amkor’s state-of-the-art manufacturing, research and development center in Incheon, South Korea.