Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies
TEMPE, Ariz., May 3, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor’sSLIM™ and SWIFT™ advanced fan-out package technologies. As a leader in electronic design automation, Cadence will provide Amkor with PADK development support based on the Cadence® Physical Verification System (PVS) software tool. This integrated solution allows Amkor’s customers to shorten the SLIM and SWIFT design and verification cycle.
“We’re at a critical juncture in the semiconductor industry with increased dependence on packaging solutions for delivery of next-generation products,” said Ron Huemoeller, Amkor’s corporate vice president, research and development. “The development of these PADKs, the latest outcome of our lengthy collaboration with Cadence, addresses a critical gap forming between foundry and back-end-of-line, as fan-out packaging solutions blur the lines between these processes. Based on our vast experience with advanced package design methodologies, Amkor is well positioned to lead the industry with our unique fan-out packaging technologies.”
By jointly developing Cadence PVS-based PADKs for SLIM and SWIFT technologies, Amkor and Cadence are filling the gap between semiconductor die design and package design, while refining design methodologies for advanced IC packaging fan-out technologies. Amkor’s PADKs will enable designers to meet the design requirements needed to ensure complete package-level sign-off verification for SLIM and SWIFT technologies and provide more seamless collaboration with their customers.
“To keep up with the industry’s faster-performing, lower-power and smaller form-factor device requirements, fan-out processing is now an essential part of advanced IC packaging,” said Steve Durrill, senior product engineering group director of the PCB Group at Cadence Design Systems. “Our partnership with Amkor fills a void when it comes to complete sign-off verification for this advanced IC packaging technology, helping to accelerate the adoption of SLIM and SWIFT technologies in this fast growing market segment.”
About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base encompasses more than 8 million square feet of floor space, with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. For more information, visit www.amkor.com.
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at http://www.cadence.com.
Note: The Amkor name and logo are registered trademarks, and SLIM and SWIFT are trademarks of Amkor Technology. Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks mentioned herein are the property of their respective companies.